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2018年3月出版ⅠMarch 2018
目录 CONTENTS
技术 Technology
34 DSA 和 EUV ：实现细间距光刻的互补性技术
DSA and EUV: the complementary technologies for fine spacing lithography
- Douglas J. Guerrero 博士，Brewer Science 常驻校际微电子研究中心（imec）专家
36 ADR AFM 让晶圆缺陷无处可藏
Wafer defects can't hide from Park Systems
40 元器件内部和外部界面的倾斜和翘曲
Mapping tilt and warp of internal and external component interfaces
- 汤姆 亚当斯 , Sonoscan 公司顾问
43 无线传感器网络使半导体晶圆制造厂保持高效率运行
Wireless sensor network keeps semiconductor wafer Fab running efficiently
- Ross Yu, ADI 公司 Dust Networks 产品部产品市场经理 ; Enrique Aceves, ADI 公司远程办公设施经理
45 免费冷热源在微电子动力厂房的综合利用
Comprehensive utilization of free cold & hot sources in power plant for wafer Fab
- 张华 , 无锡华润微电子有限公司
7 产业报道 Industry News
48 广告索引 Ad Index
关于
（原半导体科技）中国版（SiSC）是全球最重要和最权威的杂志Silicon Semiconductor的“姐妹”杂志，由香港雅时国际商讯出版，报道最新半导体产业新闻、深度分析和权威评论。为中
国半导体专业人士，提供他们需要的商业、技术和产品信息，帮助他们做出购买决策。内容覆盖半导体制造、先进封装、晶片生产、集成电路、MEMS、平板显示器等。杂志服务于中国
半导体产业，包括IC设计、制造、封装及应用等。
About Silicon Semiconductor China
Silicon Semiconductor China is the 'sister' title to Silicon Semiconductor - the world most respected and authoritative publication, published by ACT International in Hong Kong (former SST China), reports the latest news,
in-depth analysis, and authoritative commentary on the semiconductor industry. It provides for Chinese semiconductor professionals with the business and technology &product information they need to make informed
purchasing decisions. Its editorial covers semiconductor manufacturing, advanced packaging, wafer fabrication, integrated circuits, MEMs, FPDs, etc. The publication serves Chinese semiconductor industry, from IC design,
manufacture, package to application, etc.
4 2018年 2/3月 半 导体 芯 科 技 www.cazkreatif.com
